Interface engineering for high performance graphene electronic devices

Nano Convergence

Table 1 Summary of graphene transfer methods

	Graphene/metal separation	Graphene delivery to target substrate	Graphene isolation (its supporting layer)	Degree of freedom	Renewability of metal substrate	Origin of graphene defects ^c	References
Conventional polymer-assisted, wet transfer	Metal etching	Water-mediated scooping	O (PMMA)	High	X	Metal etching process	[36-39]
Electrochemical delamination/transfer	Electrochemical delamination by H₂ bubbles	Water-mediated scooping	O (PMMA)	High	O	H₂ bubbles	[44-49,52]
Adhesive-assisted dry transfer	Mechanical delamination by adhesive	Direct transfer^a	X (NA)^b	Very low	O	Incomplete delamination	[53,54]
Dry transfer with MET process	Mechanical delamination by MET process	Direct transfer^a	X (NA)^b	Low	O	Incomplete delamination	[55]
Transfer printing via direct delamination	Mechanical delamination by pre-treatment	Stamp-mediated printing	O (PVA)	High	O	Incomplete delamination	[56]

^aDelamination and transfer of graphene occur simultaneously. ^bSupporting layer is not applicable. ^cDefects include damage or contamination of transferred graphene.