Skip to main content
Nano Convergence

Table 2 Roughness of electrically conductive films containing untreated Ag/Cu and alkanethiol-modified Ag/Cu powders

From: Improvement of the thermal stability of dendritic silver-coated copper microparticles by surface modification based on molecular self-assembly

Sample

Ra (µm)

Rz (µm)

Ag/Cu

2.043 ± 0.15

13.459 ± 1.54

Ag/Cu-C4

0.719 ± 0.17

8.408 ± 1.13

Ag/Cu-C8

0.760 ± 0.13

8.608 ± 1.01

Ag/Cu-C12

0.631 ± 0.10

7.898 ± 0.47

Back to article page